Standard or High Density D-sub connectors can have press-fit contacts. Press Fit technology is a solderless connection method which is increasingly popular in mass board production.
Soldering can have several disadvantages ~ it can create thermal stress, and pretty obviously requires solder to be applied in what can be a costly reflow manufacturing process.
Press-fit technology consists of force fitting an oversized contact pin into the plated through hole of a printed circuit board (PCB) as an ‘interference’ fit.
The high radial pressure produces a deformation, resulting in a gas-tight electrical connection of high quality.
This difference in pin cross section and hole diameter results in a deformation of either the PCB hole or the cross section of the pin during the insertion process of pin into PCB hole.