MicroTCA connectors

The MicroTCA specification defines systems that accommodate plug in cards complying with the successful Advanced Mezzanine Card specification. For MicroTCA® applications, ept offers both signal connectors and power connectors that meet PICMG® specifications.

  • meets PICMG requirements
  • con:card+ seal of quality
  • guide spring for secure positioning of the AMC board
  • AMC direct connector available with or without peg
Description

Description

These cards, which were originally designed as daughter boards, plug directly into a MicroTCA system backplane, thus extending the market for AdvancedMC cards and providing an existing supplier base for MicroTCA. The specification incorporates the system management and fabric features from AdvancedTCA into platform that is scaleable from small, cost effective systems to highly available redundant systems. For MicroTCA® applications, ept offers both signal connectors and power connectors that meet PICMG® specifications. ept connectors meet the highest quality standards and help make MicroTCA® systems much more reliable.

PCB manufacturers may not be capable of meeting the AdvancedMC™ modules’ tight tolerances with certainty in the series process today. Just a single card with tolerances slightly larger than allowed by the specifications can lead to a system breakdown. The ept con:card+ connector Guide Spring offsets these tolerance deviations by constantly pressing the module against the opposite wall. As this is displaced somewhat towards the middle, the slot is optimally designed for the AdvancedMC™ module, and the mating reliability increases tremendously. In addition, the Guide Spring secures the module position in the case of shocks and vibrations. This prevents loss of contact and surface wear. ept con:card+ is a quality seal for MicroTCA® and AdvancedTCA® connectors that helps to deliver a significant increase in the reliability of MicroTCA® and AdvancedTCA® systems. In order to reach the target availability of 99.999%.

Key Features

Key Features

  • Meets PICMG requirements
  • con:card+ seal of quality
  • Guide Spring for secure positioning of the AMC board
  • Rugged construction
  • Polarising system
  • Premating contacts
  • Press fit contacts (“Eye of the needle”)
  • Selective loading of contact positions
  • Screwdown hardware
  • Special variations on request
Specifications

Specifications

AMC (Advanced Mezzanine Connector)

  • No of contacts- 170
  • Insulator – LCP UL94-VO
  • Contacts – Copper alloy
  • Contact plating – Power Au | Signal: Pd/Ni
  • Pitch- 0.75mm
  • Temperature range- -55C to +105C
  • Contact Resistance- 25mOhm max.
  • Insulation Resistance- 10 to 8th Ohm
  • Mating cycles- 200
  • Max engaging force- 100N
  • Max separation force- 65N
  • Test voltage – 80 V rms
  • Current – 1.52 @ 70C
  • Impedance – 100Ohm +/- 10%

Power connector – Backplane Connector

  • No of contacts-
    Signal 72
    Power 24
  • Insulator – PBT glass filled UL94-VO
  • Contacts – Copper alloy
  • Contact plating – Power Au | Signal Pd/Ni
  • Pitch- Signal 2.0mm
  • Temperature range- -55C to +105C
  • Test voltage – 80 V rms
  • Current Carrying cap.
    Power 12A/Pin
    Signal 1A/Pin
  • Contact Resistance- Signal 25mOhm max. | Power 5mOhm max
  • Insulation Resistance- 100 to 8th Ohm
  • Mating cycles- 200
  • Max engaging force- 50N
  • Max separation force- 50N

Power connector- Power Module Output Connector

  • No of contacts-
    Signal 72
    Power 24
  • Insulator – PBT glass filled UL94-VO
  • Contacts – Copper alloy
  • Contact plating – Power Au | Signal Pd/Ni
  • Pitch- Signal 2.0mm
  • Temperature range- -55C to +105C
  • Test voltage – 80 V rms
  • Current Carrying cap.
    Power 12A/Pin
    Signal 1A/Pin
  • Contact Resistance- Signal 25mOhm max. | Power 5mOhm max
  • Insulation Resistance- 100 to 8th Ohm
  • Mating cycles- 200
  • Max engaging force- 50N
  • Max separation force- 50N
Applications

Applications

MicroTCA brings the robustness and reliability of the AdvancedTCA approach to market segments requiring a small footprint such as access and edge applications in telecom networks. It may well extend into other applications including medical, industrial control and military.

  • MicroTCA®
  • Backplane-Daughter Cards
  • Power-Applications
  • High-Speed board-to-board