Solder Cup High Density D-Sub connectors are a popular interface for many I/O applications. Offered in 15, 26, 44, 62 and 78 positions, they are a good choice for a low cost industry standard high density connection. High Density d-sub I/O connectors offer substantial space and weight savings to PCB design engineers. Compared to the equivalent standard density D-Sub connectors, a savings of 40% in space and over 100% in weight can be achieved.
The stamped and formed solder bucket high density versions conform to commercial industry standards and will mate with any opposite gender high density D-sub from other manufacturers. Machined pin versions offer higher quality, higher amperage ratings and upwards from 200 mating operations.