These connectors are very much intended for use in high-density applications where board spacing and total weight are factors and are ideal in a wide array of consumer, industrial, and commercial applications. They are most frequently used in electronic component testing, communication equipment, medical equipment instrumentation, power converters and power supplies, along with aerospace and automotive systems and products. The most popular contact pitches are 0.039″ (1.00mm) and 0.050″ (1.27mm). These single-level card edge connectors are ideal for employment in a wide range of high-temperature, high-density medical, industrial process control and telecommunications designs in which the board is thinner or thicker than standard boards, as well as those in which a standard 1.6mm board is indicated. The parts accommodating 1mm thick boards are particularly well suited for medical applications, while those engineered for 2.4mm boards are commonly used in multi-layered, thicker board designs. The high-density 1.27mm contact centre card-edge connectors range has been expanded to include the FMBx Series. The new series features high-temperature and low-profile ultra-thin devices accommodating boards in thicknesses of 0.8mm, 1.6mm and 2.4mm. The series supports an operating temperature range of from -65C to +200C, while the low-profile ultra-thin interconnects notably offer a profile of only 12.39mm. Also available are 1mm versions, which support operating temperature ranges of from -65C to +200C.