Bi-Level Edgecard Connectors

In2Connect with Sullins newest bi-level series of straight PCB, extender card or right-angle 0.050″ (1.27mm) and 0.078″ (1.98mm) edgecard connectors. These connectors uniquely provide double the contact points in half the linear connector length.

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Description

Description

With two rows of parallel pads on each side of the PCB and two sets of pick-up contacts within the body; these connectors uniquely provide double the contact points in half the linear connector length.

Specifically engineered for heavy-duty applications, these new patented connectors are made of a high-density dielectric material to cover a -65ºC to +150ºC operating temperature range. They notably feature both primary and secondary engagement contact areas, with the secondary area recessed in the card slot. Moreover, their 0.078″ (1.98 mm) contact centerline spacing results in four rows at 0.156″ (3.96 mm) spacing, whilst the 0.050″ (1.27 mm) contact centerline spacing results in four rows at 0.100″ (2.54 mm) spacing. Connectors are RoHS compliant.

Key Features

Key Features

  • Cantilever contacts ~ spacing: 0.050″, 0.078″
  • 0.050″ contact centre spacing can replace 0.100″ to double the number of contacts within the same board area. Backwards compatible with the daughter card side.
  • 0.078″ contact centre spacing can replace 0.156″ to double the number of contacts within the same board area. Backwards compatible with the daughter card side.
  • 6/12 to 90/180 position edge card connectors
  • Double sided card edge connectors accommodate 0.062″ or 0.093″ daughter boards
  • A variety of PCB edge contact tails
  • Choice of mounting configurations from straight and right angled PCB to Card extender
  • Mounting style variations for a secure connection to the motherboard
  • Various contact plating thickness options, selective or fully plated
Specifications

Specifications

Electrical

  • Contact Current rating: 3A per contact
  • Operating voltage:
    225 AC minimum at sea level
  • Contact resistance: 30 milli Ohm @ rated current
  • Insulation Resistance:
    5000 Mega Ohm

Mechanical

  • Contact forces: 75 gram min normal force
  • Mechanical operations: – 500 Min.
  • Accommodates 0.062″ or 0.093″ daughter boards

Environmental

  • Working temperature:
    PA9T: -65 to + 150 C depends on chosen materials

Materials

  • Mouldings:
    PA9T – High temperature Polyamide
  • Contacts:
    Phosphor Bronze (standard contact): -65 to +125 C
    Beryllium Copper (available most styles): -65 to +150 C
  • Contact plating: All have 50 micron inch nickel underplate
    Generally per MIL-G-45204 or equivalent
    Fully plated 0.000010″ gold over nickel
    Fully plated 0.000030″ gold over nickel
    Selectively plated 0.000010/15″ gold over nickel with tinned tails
    Selectively plated 0.000030″ gold over nickel with tinned tails
  • Solderability:
    Meets MIL-STD-202, Method 108 (For high tin content solder in hi-temp solder applications contact sales!).
Applications

Applications

These connectors are all about saving board space and are ideal in a wide array of consumer, industrial, and commercial applications. They are most frequently used in electronic component testing, communication equipment, medical equipment instrumentation, power converters and power supplies, along with aerospace and automotive systems and products.