 "Bi-Level" - just like Dr. Doolittle's push-me, pull-you ~ seeing is believing!
With two rows of parallel pads on each side of the PCB and two sets of pick-up contacts within the body; these connectors uniquely provide double the contact points in half the linear connector length.
Specifically engineered for heavy-duty applications, these new patented connectors are made of a high-density dielectric material to cover a -65ºC to +150ºC operating temperature range. They notably feature both primary and secondary engagement contact areas, with the secondary area recessed in the card slot. Moreover, their 0.078" (1.98 mm) contact centerline spacing results in four rows at 0.156" (3.96 mm) spacing, whilst the 0.050" (1.27 mm) contact centerline spacing results in four rows at 0.100" (2.54 mm) spacing. Connectors in this new series are available in RoHS compliant versions.
Promoting horizontal board-to-board mounting, these connectors are ideally suited in environmental and burn-in testing of semiconductors, along with a wide array of industrial, consumer, and commercial usage. Among the areas of demand for the heavy-duty series are PCB boards used in communication, medical equipment, instrumentation, and automotive R&D.
UL/CUL Approved, the series offers superior design flexibility as it is backwards compatible with legacy lower-density boards, and forward compatible with boards now utilized in high-density test environments. Components accommodate PCB thickness of 0.062", and are available with from 12 to 180 contact positions. Boasting selective gold plating, they are provided standard with beryllium copper contacts to ensure contact integrity and reliability. Additional features include an insulation resistance of 5,000 Megohms minimum at 125 VDC, and a current rating of 3A.
They are engineered for conventional reflow soldering to optimize manufacturers' throughput and speed products' time-to-market. Optional keying and customization is accommodated.
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